Technological Arts Inc.

Product Info

This is a blank breakout board with dual surface-mount patterns: TSSOP or SOIC. Two rows of pads are provided, on 0.1" centers, to accommodate standard 0.025" square pins, round pins, or wires. Distance between the two rows of pads is 0.6", designed to plug into a standard wide DIP socket or a solderless breadboard. The boards are end-to-end stackable so that multiple units may be plugged into a breadboard or socket, side by side.

Features:

• suitable for use with any chip supplied in a 14-pin SOIC or TSSOP package
• end-to-end stackable
• direct one-to-one pin-numbering
• solder-masked and plated for easier chip mounting